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Subhasis Mukherjee
Subhasis Mukherjee
Apple April
Principal IC Packaging Engineer
University of Maryland
United States
Biography
Dr. Subhasis Mukharjee working in Apple April, 2019 – Present as Principal IC Packaging Engineer
§NAND package design, assembly process & material development, and reliability testing.
§ SiP (System in Package) architecture design including substrate layout, package stack up and PCB stack up design.
§ Semiconductor packaging assembly process for wire bond, flipchip, PoP, 2.5D interposer, 3D TSV packages.
§ Material testing and Finite Element Modeling of IC package under diff. loading conditions.
Research Interest
Mechanical testing, Characterization of material properties, Reliability testing & failure analysis of electronic packages,
Numerical modeling of creep/fatigue response of electronic components and packages using finite element programs
(ANSYS/ABAQUS) under accelerated loading conditions, and Statistical analysis of experimental data using JMP.